Prime Minister Narendra Modi on Saturday inaugurated the CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat. He described it as a historic milestone in India’s semiconductor journey. On the country’s ambition to become a global semiconductor hub, he said that this is a historic day for India’s semiconductor sector. The CG Semi OSAT facility located at Sanand will strengthen the chip manufacturing ecosystem, promote technological self-reliance and strengthen India’s position in the global semiconductor value chain.
Addressing the inauguration ceremony, PM Modi expressed confidence that this facility will meet its production target. He said, ‘I have been told that from now on 20 crore chips will be produced here every year. I am sure you will achieve this soon. This confidence also stems from the fact that the SEMICON India program is gaining momentum. Slowly, brick by brick and now chip by chip. We have set a target of producing 5 crore chips every year. I am confident that you will achieve this goal very soon. I heartily congratulate the entire team of CG Semi.
‘This is the roadmap of developed India’
The Prime Minister said that India’s progress in the semiconductor sector has not happened suddenly, but is part of a decade-long transformation in the electronics sector. He said that the country has made steady progress from manufacturing of finished products to manufacturing of components and is now entering the field of semiconductor manufacturing, with the aim of establishing the entire electronics value chain within India. He said that this is the roadmap of developed India, this is the next phase of Make in India.
India is the second largest mobile manufacturing country in the world
Speaking on the country’s achievements in electronics manufacturing, PM Modi said that India has become the world’s second largest mobile manufacturer as well as the second largest mobile exporter. He said that today India’s total electronics production has increased by almost seven times as compared to 2014 and electronics exports have increased by almost 11 times.
‘We will make the country a semiconductor hub’
He said, ‘Five years ago India had resolved that we will make the country a semiconductor hub. We have moved forward with the mantra of ‘Design in India, Make in India’ and today the production of chip packaging is also starting in the third semiconductor facility of the country. The PM said that he had laid the foundation stone of this facility in 2024 and the chip testing work in the facility started in August 2025 and it has been inaugurated today.
Japan, America will also chip in
Union Minister of Electronics and Information Technology Ashwini Vaishnav was also present in this inauguration ceremony. He said that the chips made in this OSAT facility will be used in automobile and industrial applications, while a significant part of it will also be exported to Japan, America and Europe.
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