India’s efforts to expand semiconductor manufacturing got another boost when Union Electronics and IT Minister Ashwini Vaishnav announced on Friday that the Odisha government, Intel and 3DGS have signed a Memorandum of Understanding (MoU) to bring substrate manufacturing technology to the country.
Giving information about this agreement on Social Media
Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India.
This will further advance semiconductor ecosystem in India. pic.twitter.com/elxs6r8muN
— Ashwini Vaishnaw (@AshwiniVaishnaw) May 29, 2026
Aim to strengthen semiconductor ecosystem
The purpose of this agreement is to strengthen the country’s semiconductor ecosystem, as the country wants to expand its domestic chip manufacturing capabilities and create a complete electronics supply chain. Substrate manufacturing is a critical part of semiconductor production, as substrates help connect and support semiconductor chips used in electronic technology.
This development comes a few weeks after the Union Cabinet approved two semiconductor projects under the India Semiconductor Mission (ISM). The projects approved include the country’s first commercial mini or micro-LED display facility based on Gallium Nitride (GaN) technology and a semiconductor packaging facility in Gujarat.
4 semiconductor plants will be ready in 2026
Overall, both these projects involve an investment of about Rs 3,936 crore and are expected to generate employment for 2,230 skilled professionals. This latest agreement (MoU) is also under the big semiconductor roadmap of the central government, which was announced earlier this year.
In March, IT Minister Vaishnaw had said that 4 semiconductor plants are expected to be ready in India by 2026, while 2 more plants are planned for 2027. He also said that India’s first fabrication unit in Dholera is likely to be operational by 2028. Then he also said that the semiconductor program is being supported by the development of machinery, chemicals, gases and testing infrastructure.
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